| NO | Item | Capability |
| 1 | Surface Finish | HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc |
| 2 | Layer | 1-30 layers |
| 3 | Min.Line Width | 3mil |
| 4 | Min.Line Space | 3mil |
| 5 | Min.Space between Pad to Pad | 3mil |
| 6 | Min.Hole Diameter | 0.10mm |
| 7 | Min.Bonding Pad Diameter | 10mil |
| 8 | Max.Proportion of Drilling Hole and Board Thickness | 1:12:05 |
| 9 | Max.Size of Finish Board | 23inch*35inch |
| 10 | Rang of Finish Board′s Thickness | 0.21-7.0mm |
| 11 | Min.Thickness of Soldermask | 10um |
| 12 | Soldermask |
Green,Yellow,Black,White,Red,Purple, transparent photosensitive solder mask,Strippable solder mask |
| 13 | Min.Linewidth of Idents | 4mil |
| 14 | Min.Height of Idents | 25mil |
| 15 | Color of Silk-screen | White,Yellow,Black |
| 16 | Date File Format |
Gerber file and Drilling file,Report series,Altium, PADS 2000 series,powerpcb series,ODB++,... |
| 17 | E-testing | 100%E-Test:High Voltage Testing |
| 18 | Material for PCB |
High TG Material,High Frequence(ROGERS,TEFLON,TADONIC,ARLON) Haloger free Material |
| 19 | Other Test | Impedance Testing,Resisitance Testing,Microsection etc |
| 20 | Special Technological Requirement | Blind&Buried Vias and High Thickness Copper |
| NO | Item | Capability |
| 1 | Product Type | Al Clad PCB 1 layer |
| 2 | Maximum Panel size | 1500mm*600mm |
| 3 | Copper thickness | 0.5oz, 1oz, 2oz, 3oz |
| 4 | Dielectric Thickness(to Substrate) | 0.05mm, 0.075mm, 0.1mm, 0.15mm, 0.2mm |
| 5 | Substrate Core Thickness | 0.4mm,0.6mm,0.8mm,1.0mm,1.2mm,1.5mm,2.0mm,3.0mm,3.2mm |
| 6 | Finished Board Thickness | 0.4mm To 4.0mm |
| 7 | Thickness Tolerance | +/- 10% |
| 8 | Aluminum Machining | Drilling,Tapping,Milling, Routing, Die-Punching,break-off tab available |
| 9 | Min. Finish hole size | 0.25mm |
| 10 | Max. working voltage | 2.5k VDC(0.075mm Dielectric) 3.75k VDC(0.15mm Dielectric) |
| 11 | Min. Track Width | 0.2mm (8mils) |
| 12 | Min. Track gap | 0.2mm (8mils) |
| 13 | Min. SMD pad pitch | 0.2mm (8mils) |
| 14 | Surface Finishing | HASL, HASLLeadfree, Immersion gold, OSP |
| 15 | Solder mask color | White, LED light special White, Black, MATT Black, others Available |
| 16 | Legend color | Black, White, others Available |
| 17 | E-testing | YES |
| 18 | Rosh | YES |
| 19 | Reference Standard | IPC-A-600G Class 2 |
| 20 | Special holes | Spot facing, Cup holes |
| 21 | Data Input | Gerbers, AutoCad, Cam350, ALTIUM,PROTEL,DXP,POWER PCB,.. |
| NO | Item | Capability |
| 1 | Product Type | 1-8 Layer |
| 2 | Board Size | Min 6mm*6mm, Max 400mm*500mm |
| 3 | Board Thickness | 0.075mm - 2.0mm |
| 4 | Copper Thickness | 0.5oz - 2.0oz |
| 5 | Min Annular Ring | 4mil |
| 6 | Min Hole Diameter | 8mil |
| 7 | Surface Finishing | HASL, HASL Leadfree, Immersion Tin, Gold Finger, OSP |
Khách hàng của chúng tôi
ĐỐI TÁC CỦA CHÚNG TÔI
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