PCB Structure Diagram 

Rigid PCB Process Capability     
NO Item Capability
1 Surface Finish HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc
2 Layer 1-30 layers
3 Min.Line Width 3mil
4 Min.Line Space 3mil
5 Min.Space between Pad to Pad 3mil
6 Min.Hole Diameter 0.10mm
7 Min.Bonding Pad Diameter 10mil
8 Max.Proportion of Drilling Hole and Board Thickness 1:12:05
9 Max.Size of Finish Board 23inch*35inch
10 Rang of Finish Board′s Thickness 0.21-7.0mm
11 Min.Thickness of Soldermask 10um
12 Soldermask


transparent photosensitive solder mask,Strippable solder mask

13 Min.Linewidth of Idents 4mil
14 Min.Height of Idents 25mil
15 Color of Silk-screen White,Yellow,Black
16 Date File Format

Gerber file and Drilling file,Report series,Altium,

PADS 2000 series,powerpcb series,ODB++,...

17 E-testing 100%E-Test:High Voltage Testing
18 Material for PCB

High TG Material,High Frequence(ROGERS,TEFLON,TADONIC,ARLON)

Haloger free Material

19 Other Test Impedance Testing,Resisitance Testing,Microsection etc
20 Special Technological Requirement Blind&Buried Vias and High Thickness Copper
Aluminium PCB Process Capability      
NO Item Capability
1 Product Type Al Clad PCB 1 layer
2 Maximum Panel size 1500mm*600mm
3 Copper thickness 0.5oz, 1oz, 2oz, 3oz
4 Dielectric Thickness(to Substrate) 0.05mm, 0.075mm, 0.1mm, 0.15mm, 0.2mm
5 Substrate Core Thickness 0.4mm,0.6mm,0.8mm,1.0mm,1.2mm,1.5mm,2.0mm,3.0mm,3.2mm
6 Finished Board Thickness 0.4mm To 4.0mm
7 Thickness Tolerance +/- 10%
8 Aluminum Machining Drilling,Tapping,Milling, Routing, Die-Punching,break-off tab available
9 Min. Finish hole size 0.25mm
10 Max. working voltage 2.5k VDC(0.075mm Dielectric) 3.75k VDC(0.15mm Dielectric)
11 Min. Track Width 0.2mm (8mils)
12 Min. Track gap 0.2mm (8mils)
13 Min. SMD pad pitch 0.2mm (8mils)
14 Surface Finishing HASL, HASLLeadfree, Immersion gold, OSP
15 Solder mask color White, LED light special White, Black, MATT Black, others Available
16 Legend color Black, White, others Available
17 E-testing YES
18 Rosh YES
19 Reference Standard IPC-A-600G Class 2
20 Special holes Spot facing, Cup holes
21 Data Input Gerbers, AutoCad, Cam350, ALTIUM,PROTEL,DXP,POWER PCB,..


Flexible PCB Process Capability        
NO Item Capability
1 Product Type 1-8 Layer
2 Board Size Min 6mm*6mm, Max 400mm*500mm
3 Board Thickness 0.075mm - 2.0mm
4 Copper Thickness 0.5oz - 2.0oz
5 Min Annular Ring 4mil
6 Min Hole Diameter 8mil
7 Surface Finishing HASL, HASL Leadfree, Immersion Tin, Gold Finger, OSP

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